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Hybrid MEMS Technology 2.0
...Hybrid design is to leverage multi-layer composite MEMS fabrication technology, which allows the optimal wafer test performance by including otherwise mutually exclusive requirements such as fine-pitch and high current carrying...
ReAlign for SUMMIT200
...years. It sets the benchmark in automated probe-to-pad alignment for applications with limited microscope view such as vertical and Pyramid probe cards, and enables autonomous semiconductor test at multiple temperatures....
We Did it Again – A Five-Star Rating in VLSIresearch Customer Satisfaction Survey
...in THE BEST Suppliers of Test Subsystems which includes manufacturers of probe cards, test sockets, and device interface boards. In April, the company was also ranked as the world’s top...
Characterization of Micro-Bumps for 3DIC Wafer Acceptance Tests
...paper, custom DC positioners with theta-X planarizing capability and true Kelvin probes have allowed for successful demonstration of consistent and repeatable test results in fully automatic micro-bump wafer acceptance tests....
HPD IQ3000 Datasheet
...commercial quantum and superconducting computers, we provide chip developers with the tools they need to intelligently iterate on their designs. TheIQ3000 integrates configurable DC and RF cabling, with custom probe...
TESLA300 Data Sheet
The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables collection of accurate high-voltage and high-current measurement data, with complete operator safety.
Genus
The Genus probe card is FormFactor’s newest 300 mm full-wafer contact testing solution for NAND Flash applications. The product enables one touchdown capability for NAND Flash testing with high pin...
A Guide to Full Autonomous Operation Using MLTRL Calibration on and off the Wafer
FormFactor has previously shown the Autonomous RF Measurement assistant using LRRM Calibration. Autonomous RF is used to manage the entire test flow for thermal and ambient testing. This includes the...
Accelerated Solid State Qubit Pre-Screening
...to eliminate wire-bonding and packaging from cryogenic test processes and to provide critical qubit performance parameters at 50 mK, thus streamlining device deployment, and reducing the time for development cycles...
HPD IQ2000 Data Sheet
FormFactor’s HPD IQ2000 is a high throughput chip-scale prober for singulated die testing at 4 K or 2 K. The system’s load-lock design enables thermalization of the device under test...
Now On Demand – Making Traceable and Accurate sub-THz Measurements
...routine measurement of wafer S-parameters and RF measurements at sub-THz frequencies has become commonplace for test engineers. Precision, consistency, and traceability in tests, particularly for active devices, are essential prerequisites...
Complex Impedance Matching Structures for Advanced On–Wafer AiP
...In this work, we present complex impedance matching structures embedded in FormFactor’s Pyramid Core that will play a major role in improving wafer test coverage with better yield and lower...
Small Pad Probing: 5 Problems with Conventional Probes with Multiple Needles
...tests need to be done quickly, reliably and with repeatable accuracy. These needs require rethinking of how device probing is accomplished and development of a fundamentally new component probing technology...
3 Recommended Abrasive Cleaning Media for Online Pyramid Probe Cleaning
...The most common source of this type of cleaning film is International Test Solutions (ITS). Abrasive-loaded elastomer media consist of a pretty thick layer of elastomer (such as silicone, polyurethane,...
The Importance of Contact Performance for Accurate RF Measurement Results
...under test (DUT), repeated calibration and significant increases in test time. Moreover, unnecessary touchdowns on the calibration standards and DUT pads decrease the lifetime of the calibration substrate, destroy DUT...