503-601-1000  ::  Contact Us  ::  Log On  ::  日本語

Tesla

What's New

Technology News

Connect With Us

More News

Mar. 15, 2016 :: EVENT
Mar. 19, 2016 :: EVENT
JSAP Expo Spring
Mar. 28, 2016 :: EVENT
Apr. 19, 2016 :: EVENT

More Events

Velox

Automated Testing of Bare Die-to-Die Stacks

This paper presents an approach to perform automatic stepping and probing on arrays of D2D stacks pick-n-placed (PnP) on a carrier substrate. An algorithm will be described for the Cascade Microtech CM300 probe station to automatically correct small PnP misalignments. Experimental results will be presented on three types of carriers: (1) dicing tape on tape frames for Ø 100 mm wafers, (2) sheets of single-sided thermal-release tape, and (3) Ø 300 mm carrier wafers with double-sided thermal-release tape.

Download Reprint (PDF)


3 Key Challenges for Consistent, Accurate RF Measurement Results

Engineers deal with architectures and multi-functional ICs that continuously decrease physical dimensions, while operation frequencies and levels of integration complexity increase. Learn how they achieve high levels of accuracy and confidence in measurement results.

Download Technical Review (PDF)


Tomorrow’s Chip Interconnects Call for New Reliability Test Method

Shrinking semiconductor geometries with reduced reliability margins demand a highly accurate method for modeling EM ef­fects to produce proper IC design rules. CVEM offers a precise solution to avoid these pitfalls and enable IC manufacturers to continue offering aggressive perfor­mance specifications without sacrificing quality.

Download Article Reprint (PDF)


Consistent Parameter Extraction for Advanced RF Devices

Consistent Parameter Extraction for Advanced RF Devices

Pushing device operation frequencies towards the sub-THz range causes serious challenges for conventional device characterization techniques. This application note presents a comparison of SOLT, NIST multiline TRL, and LRRM probe-tip calibration methods for accuracy of measured and extracted figure of merits (FoM) of advanced BiCMOS HBT. A good understanding of possible sources of errors and potential room for improvement at each step are key to increasing the accuracy of device characterization. This paper will show why eLRRM is recommended as an accurate, consistent and easy to implement probe tip calibration method for characterization of advanced high-performance active devices.

View Application Note


Direct Probing on Large-Array Fine-Pitch Micro-Bumps of a Wide-I/O Logic-Memory Interface

Experiments show the technical feasibility of the direct probing approach, with probe tips making proper electrical contact to the micro-bumps, causing only limited probe marks and no measureable impact on stack interconnect yield. Cost modeling indicates economic feasibility for single-site testing, with the next step to prepare the technology for volume production.

Download Reprint (PDF)


New Calibration Solutions for Multi-Channel Probes using an Added Port for Thru Measurements

A new method is proposed for calibrating multichannel probes placed in multiple quadrants for wafer or chip level measurement. It uses an additional ground-signal-ground probe to enable thru measurements in a conventional calibration procedure, avoiding the need for custom calibration kits. The inherent delay inconsistencies in the proposed method are shown to be small enough to have minimal effects on the measurement uncertainties, in most practical cases.

View White Paper


Please see this important announcement regarding Microsoft Windows XP.

FormFactor Enters Definitive Agreement to Acquire Cascade Microtech

Leveraging combined global support and channel investments across a product line that spans from engineering to production test applications, the combined company will be uniquely positioned to solve customers’ most difficult test challenges from engineering to production.

Press Release | Investor Presentation


Introducing EPS200MMW- achieve accurate measurement results at 67 GHz up to THz frequencies

EPS200MMW

At higher frequencies, probe placement with submicron accuracy on calibration substrates and DUTs is critical for accurate and repeatable measurement results. The EPS200MMW manual 200 mm probe solution addresses this need with its rigid case-base frame, solid platen with four-point support and highly-refined granite base plate, and includes a fine-glide chuck stage to offer both wide-range coarse movement and submicron-level fine movement.

Learn More: 200 mm Probe Systems



Flexible 300 mm Probing Platform

CM300 Probe System

Cascade Microtech’s CM300 is a flexible on-wafer measurement platform that scales to meet evolving needs in capability and automation. It enhances device and process characterization and modeling by capturing the true electrical performance of devices and enabling hands-off productivity. With the new Velox™ probe station control software, the CM300 enables safe and fast wafer loading and easy test automation and measurement system integration, while preventing damage of probe tips, probe cards and customer wafers throughout the entire measurement cycle. Read more ...


New Velox Probe Station Control Software

Velox

Velox harnesses the flexibility of Nucleus and the power of ProberBench, and enables the fastest time-to-job completion for mixed environment labs. Velox gives you several options to simplify the setup and execution of automated sequences on your probe stations. Upgrade to Velox today and achieve gains in both speed and productivity.

Learn more: Velox - Probe Station Control Software


MeasureOne Solutions Provide New Level of Integration Capabilities

By leveraging the cumulative experience of Cascade Microtech and its MeasureOne partners- all who perform as best in breed in their category- customers can streamline their processes and realize efficient, "true to measurement" solutions that deliver speed to market and fast return on their investment.

MeasureOne


Reducing Risk and Cost When Purchasing Refurbished Equipment

Meeting the needs of advanced node device manufacturing is driving a rise in fab capacity, in particular for new mobility, sensing and IoT applications. Many of these devices are based on mature technologies, leading manufacturers to consider refurbished or remanufactured test and measurement equipment. Learn how to reduce risk and cost by sourcing directly from the OEM.

Sourcing Refurbished Equipment Article

View article or learn more about our SourceOne program