June 4, 2012Industry's First Fully-Automatic High-Power Device Measurement Probe System
Cascade Microtech Introduces the APS200TESLA, a Fully-Integrated Solution for On-Wafer Power Device Test
BEAVERTON, OR--(Marketwire - June 4, 2012) - Cascade Microtech, Inc. (NASDAQ: CSCD), a leading expert at enabling precision measurements of integrated circuits at the wafer level, today introduced the new APS200TESLA. This innovative, turn-key system combines the proven capabilities of its Tesla on-wafer power device characterization measurement technology with Cascade Microtech's BlueRay™ production automation technology to deliver the industry's first complete on-wafer production solution to address the test challenges of discrete power devices.
As power semiconductors grow with the demand for energy-efficient and environmentally-friendly products, power device manufacturing will shift from silicon substrates to silicon carbide (SiC), gallium nitride (GaN), and gallium nitride on silicon (GaN-on-Si). These new substrate technologies offer improved efficiency and enable higher levels of power, and faster switching, in many applications using insulated gate bipolar transistors (IGBTs) and MOSFETS, such as automotive and consumer electronics, electrical power distribution and large data centers.
Fast-growing applications in renewable energy and industrial power will challenge power device manufacturers to develop more efficient devices at a lower cost, driving the need for test solutions specifically designed for high-voltage/high-current probing. Cascade Microtech meets this challenge with the first fully-automatic on-wafer probe system for high-power device measurement. Rated up to 10k V/400 A, the APS200TESLA delivers unmatched electrical performance for high-voltage and high-current device characterization at production levels. The system comes with a high-voltage/high-current probe card, a high-voltage/high-power chuck port, and the patent-pending MicroVac™ high-power chuck that can handle wafer thicknesses down to 50 µm, such as the ultra-thin Taiko wafers. An optimized electrical connection easily integrates the APS200TESLA with a variety of test instruments, and the interlock-enabled safety shield provides a safe environment for the operator. The arc-suppression feature allows the customer to optimize device layout to achieve better yields. Auto-discharging and the unique probe-pin touch sensing capability prevent device damage due to high-voltage discharge during die-to-die moves. The APS200TESLA also offers advanced prober control software for automatic wafer and die stepping.
"The new APS200TESLA leverages our experience in achieving accurate on-wafer measurement. It is an advanced, turn-key power device measurement system that will help our customers improve cost-of-ownership, increasing test throughput and improving yields," said Michael Burger, president and CEO, Cascade Microtech, Inc. "It allows our customers to save time by avoiding unnecessary dicing and packaging prior to final test. By testing on-wafer in a production environment, the APS200TESLA enables our customers to reduce test costs and get their products to market faster."