Cascade Microtech’s CM300 on-wafer probe station was a vital part of the overall solution used in the SiP miniaturization efforts recently accomplished by Infineon Technologies. One of the key areas undergoing research is direct probing on fine-pitch micro-bumps that interconnect 3D-stacked dies. Both fine-pitch, low-force probe cards and a highly accurate prober are required. The combination of our Pyramid Probe® advanced technology and the accuracy of the CM300 deliver on these requirements
A new method is proposed for calibrating multichannel probes placed in multiple quadrants for wafer or chip level measurement. It uses an additional ground-signal-ground probe to enable thru measurements in a conventional calibration procedure, avoiding the need for custom calibration kits. The inherent delay inconsistencies in the proposed method are shown to be small enough to have minimal effects on the measurement uncertainties, in most practical cases.
Danube Integrated Circuit Engineering (DICE), a radar IC manufacturer in Austria, makes mmW receiver/transmitter ICs for automotive collision avoidance radar applications. These devices have close to 100 connections surrounding a 5 mm2 die, with up to 25 mixed-signal contacts per side, limiting the size of the pads to 80 μm x 80 μm. Read our case study and learn how DICE overcame testing challenges and reduced test times by 50% using InfinityQuad probes. [Download]
Pushing device operation frequencies towards the sub-THz range causes serious challenges for conventional device characterization techniques. This application note presents a comparison of SOLT, NIST multiline TRL, and LRRM probe-tip calibration methods for accuracy of measured and extracted figure of merits (FoM) of advanced BiCMOS HBT. A good understanding of possible sources of errors and potential room for improvement at each step are key to increasing the accuracy of device characterization. This paper will show why eLRRM is recommended as an accurate, consistent and easy to implement probe tip calibration method for characterization of advanced high-performance active devices.