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Probing 25 μm-diameter Micro-bumps for Wide-I/O 3D SICs

Direct micro-bump probing is proving to be a more cost-effective and technologically complete method than dedicated prebond probe pads. However, it requires advanced probe cards and probe stations. Recent work on test wafers has resulted in successfully probing single-channel wide-I/O micro-bumps at 25 μm diameter. Work continues to further prove out this methodology on actual Wide-I/O DRAM.

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Predicting end-of-life for future mobile devices

Each new generation of mobile devices demands increased capability without sacrificing reliability. Intrinsic semiconductor reliability evaluation enables designers to optimize both performance and quality. Learn how advanced test tools bring more sophisticated, reliable mobile products to market faster.

Learn more on our blog or Download Reprint


Working to Advance System-in-Package Miniaturization

Cascade Microtech’s CM300 on-wafer probe station was a vital part of the overall solution used in the SiP miniaturization efforts recently accomplished by Infineon Technologies. One of the key areas undergoing research is direct probing on fine-pitch micro-bumps that interconnect 3D-stacked dies. Both fine-pitch, low-force probe cards and a highly accurate prober are required. The combination of our Pyramid Probe® advanced technology and the accuracy of the CM300 deliver on these requirements

Learn more on our blog or Infineon's Press Release


New Calibration Solutions for Multi-Channel Probes using an Added Port for Thru Measurements

A new method is proposed for calibrating multichannel probes placed in multiple quadrants for wafer or chip level measurement. It uses an additional ground-signal-ground probe to enable thru measurements in a conventional calibration procedure, avoiding the need for custom calibration kits. The inherent delay inconsistencies in the proposed method are shown to be small enough to have minimal effects on the measurement uncertainties, in most practical cases.

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Consistent Parameter Extraction for Advanced RF Devices

Consistent Parameter Extraction for Advanced RF Devices

Pushing device operation frequencies towards the sub-THz range causes serious challenges for conventional device characterization techniques. This application note presents a comparison of SOLT, NIST multiline TRL, and LRRM probe-tip calibration methods for accuracy of measured and extracted figure of merits (FoM) of advanced BiCMOS HBT. A good understanding of possible sources of errors and potential room for improvement at each step are key to increasing the accuracy of device characterization. This paper will show why eLRRM is recommended as an accurate, consistent and easy to implement probe tip calibration method for characterization of advanced high-performance active devices.

View Application Note


Please see this important announcement regarding Microsoft Windows XP.

Cascade Microtech收购Aetrium可靠性测试产品业务

Reliability Test Products

本次收购强化了公司的产品整合以及晶圆工艺技术在晶圆级可靠性方面的解决方案。该收购与公司致力于提供综合测量解决方案用以满足先进半导体工艺中产生的新兴需求的战略紧密契合。

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